STRUCTURAL BONDING FOR LOW ENERGY POLYMERS

PolyBond33 adhesive is designed to provide the maximum bond between low energy substrates such as polypropylene(PP) and polyethylene (PE). These polymer substrates have traditionally been extremely difficult to work with. The two-part adhesive was developed to provide a covalent bond. It will bond to just about any product made from PE or PP and will also bond to wood, paper, metals, foams and other plastics such as PVC and Polystyrene. The adhesive cures in 24 hours and is packaged in convenient, easy to use dual dispense cartridges sized from 50mL to 400mL. It is also available in 5 gallon pail and 55 gallon drum sets.

The adhesive was designed to work throughout the usable temperature range (-40°F to +280°F) of both polypropylene and polyethylene substrates. It is designed to remain flexible, which allows the adhesive to accommodate expansion and contraction during temperature changes and maintain a strong bond during impact and vibration. It is not affected by moisture or most chemicals including industrial solvents and cleansers.

For more information, contact Stephen Harris, Essential Molding Supplies, 6607 Condor Run, Littleton, CO 80125, 303-948-5434, FAX 303-972-0018, E-mail: sales@ MoldingSupplies.com.